Home > Program > Keynote Speakers

12th
International
SoC Design
Conference

November 2-5, 2015
Hotel Hyundai, Gyeongju, Korea

Program

Keynote Speakers

[Keynote #1] Nov. 3rd, 10:15-11:00AM

Title : Smart Healthcare – semiconductor help people and save lives

JOHN YONG-IN PARK,
Senior Vice President, Samsung Electronics Co., Ltd., Korea.

Biography
Yong-In Park has been a senior vice president and responsible for the mobile healthcare and sensor products development in Samsung Electronics since April 2014. Before Samsung, he had been a president, Chief Executive Officer and DognbuHitek’s Board of directors since 2009. He was a vice chairman of KSIA (Korea Semiconductor Industry Association) from 2009 to 2014. Prior to joining DongbuHitek, Mr. Park held key technology management positions and technical staffs at Texas Instruments Inc., Dallas, Texas from 1999 to 2007. During his illustrious tenure, he pioneered the development of several high-speed and high-resolution data converter products. Earlier in his career, he served as an analog group leader responsible for analog IP and mixed-signal products for LG, Seoul, Korea from 1987 to 1999. During his time with LG, he visited Hitachi, Japan, as a member of a technical transfer team for two years since 1989, and a visiting scholar at the University of Illinois at Urbana Champaign for 2 years since 1994.
Mr. Park received his BA and master degree of Electronics from Yonsei University, Seoul, Korea.
He is an author or co-author of 7 papers in journals, conference proceedings and books and holder of 28 U.S, European, Japanese, and Korean patents.

Abstract
Over the decades, semiconductor technology has been developed for helping people to live creative and healthy lives. For example, a high performance processor along with large scale memory storage mimics intelligence of the human brain. Efficient power IC serves as a human heart to supply necessary energy. Variety of sensors mirrors the five senses of human being. Communication network helps to link data from sensors with processor like neural network of human being.
Maturity of recent sensor technologies in image and sound signal processing opens door to various commercial applications such as night vision and voice recognition instead of human eyes and ears. Moreover, sensors for smell and taste are widely considered in research domain. An electrochemical nose (e-nose) based on an array of chemical gas sensors works as an artificial olfaction to identify gases, odors, and vapors. Electronic tongue (e-tongue) on the other hand based on an array of liquid sensors differentiates sweetness and saltiness. This talk will focus on Smart Healthcare applications and introduces variety of physiological sensors from technology fundamentals to future trends.

[keynote#2]Nov. 3rd, 11:00-11:45 AM

Title : IoT: New Requirements from Silicon to Software

Chi-Foon Chan,
President & Co-CEO, Synopsys Inc., USA

Biography
As Synopsys’ co-CEO, Dr. Chi-Foon Chan shares responsibility for crafting vision and strategy, leading the company, and ensuring execution excellence in support of our customers’ success. As the company’s President and COO, a role Dr. Chan held for 14 years prior to his 2012 appointment to President and co-CEO, he guided internal operations and worldwide field organizations. Dr. Chan joined Synopsys in 1990 as Vice President of Applications and Services where he helped build the Technical Field organization. He has sponsored several key initiatives such as entering the IP market, and personally facilitated key acquisitions such as Avant!, Virage Logic, Magma Design Automation and SpringSoft. Most recently, he was involved in Synopsys’ entry into the software testing market with the acquisition of Coverity. Prior to Synopsys, Dr. Chan contributed to industry leading companies like NEC Corporation, where he was General Manager of the microprocessor group, responsible for marketing all NEC chip devices in North America. Prior to NEC, Dr. Chan was an engineering manager at Intel Corporation. Dr. Chan holds an M.S. and a Ph.D. in Computer Engineering from Case Western Reserve University; and a B.S. in Electrical Engineering from Rutgers University.

Abstract
The accelerated pace of technology is driving tremendous growth in new devices and applications, and technical innovation is the driving force in the world's economy. New opportunities within the Internet of Things (IoT) introduce new risks, and finding ways to increase security is essential. These trends are leading into a decade of smart everything that will impact both technology and business models. In this era, the challenges have never been greater. Dr. Chan's presentation will explore the new requirements from ‘silicon to software’ as hardware designers and software developers create the faster, smarter and safer products that will transform the way we live and work.

[keynote#3]Nov. 3rd, 11:45-12:30 AM

Title : Near-Field Coupling Integration Technology for Internet of Things

Tadahiro Kuroda,
Professor, Keio University, Japan

Biography
Tadahiro Kuroda received the Ph.D. degree in electrical engineering from the University of Tokyo. In 1982, he joined Toshiba Corporation. In 2000, he moved to Keio University, where he has been a professor since 2002. He was a Visiting MacKay Professor at the University of California, Berkeley in 2007. His research interests include low-power CMOS design, near-field-coupling integration technology and artificial intelligence. He has published more than 200 papers, including 37 ISSCC papers, 26 VLSI Symposia papers, 19 CICC papers and 16 A-SSCC papers. He wrote 22 books/chapters and filed >150 patents. He is an IEEE Fellow and an IEICE Fellow.

Abstract
Internet of Things requires big data analysis and small sensor network. 3D integration and modular design are key to efficiency of energy dissipation and development cost. My proposal is to replace mechanical connections using wires, solders, and connectors by electrical ones using near-field coupling. In this presentation, ThruChip Interface (TCI) using inductive coupling for chip stacking and Transmission Line Coupler (TLC) using electromagnetic coupling for module connection will be presented and discussed. TCI will enable data centric computing for big data analysis and TLC will make small sensors connected like LEGO Bricks.

[keynote #4]Nov. 4th, 11:00-11:45 AM

Title : Toward Brain-Machine-Brain Interfaces for the Treatment of Neurodegenerative Diseases

Mohamad Sawan,
Professor, and Canada Research Chair,
PolystimNeurotech Lab., Polytechnique Montréal, Canada

Biography
Mohamad Sawan received the Ph.D. degree in 1990 in Electrical Engineering, from Sherbrooke University, Canada. He joined Polytechnique Montreal in 1991, where he is currently a Professor of microelectronics and biomedical engineering. His interests are the design and test of analog, digital, RF, and optic circuits and Microsystems. Dr. Sawan is a holder of a Canada Research Chair in Smart Medical Devices, he is leading the Microsystems Strategic Alliance of Quebec (ReSMiQ), and is founder of the PolystimNeurotechnologies Laboratory. Dr. Sawan is founder and cofounder of several international conferences such as the IEEE NEWCAS, ICECS, and BIOCAS. He is also cofounder and Associate Editor (AE) of the IEEE Trans. on BIOCAS, Deputy Editor-in Chief of the IEEE TCAS-II (2009-2013), Associate Editor of the IEEE Trans. on Biomedical Engineering, and he is Editor and Associate Editor, and member of the board of several other international Journals. Dr. Sawan is founder and chair of the Eastern Canadian IEEE-Solid State Circuits Society Chapter. He published more than 700 peer reviewed papers, two books, 10 book chapters, and 12 patents. Dr. Sawan received several awards, among them the Shanghai Municipality International Collaboration award, the Queen Elizabeth II Golden Jubilee Medal, the Bombardier Medal for technology transfer, the Jacques-Rousseau Award for achieved results in multidisciplinary research activities, the medal of merit from the President of Lebanon for his outstanding contributions, and the Barbara Turnbull Award for spinal-cord research in Canada. He is Fellow of the IEEE, Fellow of the Canadian Academy of Engineering, Fellow of the Engineering Institute of Canada, and Officer of the Quebec’s National Order.

Abstract
Wearable and Implantable Brain-Machine Interfaces intended for the diagnostic and treatment of neurodegenerative diseases are promising alternative to study neural activities underlying cognitive functions and pathologies, and eventually to recover lost neural vital functions. This talk covers circuit techniques and Microsystems intended for intracorticalneurorecording and neurostimulation. The implementation of custom SOC-based devices requires dealing with multidimensional design challenges such as power management, low-power circuit design, high-data rate communication, and reliable wireless energy recovery. Case studies of continuous neurorecording intended for learning about the intracortical vision mechanism, and for spike onset detection of epileptic seizure focus localization and treatment will be described. In addition, microstimulation in the primary visual cortex intended to recover vision for the blind through multisite large arrays of microelectrodes will be reported. Finally, Lab-on-chip (LoC) based neuro-transmitters detection, manipulation and characterization intended to locate dysfunctions at the level of neural cells interconnections will be summarized.

[keynote #5]Nov. 4th, 11:45-12:30 AM

Title : Wearable devices - Wireless Transceiver for Implantable Medical application

Zhihua Wang,
Professor, Tsinghua University, China

Biography
Zhihua Wang received the B.S., M.S., and Ph.D. degrees in electronic engineering from Tsinghua University, Beijing, China, in 1983, 1985, and 1990, respectively. In 1983, he joined the faculty at Tsinghua University, where he is a Full Professor since 1997 and Deputy Director of Institute of Microelectronics since 2000. From 1992 to 1993, he was a visiting scholar at Carnegie Mellon University. From 1993 to 1994, he was a Visiting Researcher at KU Leuven, Belgium. From September 2014 to March 2015, he was a Visiting professor in Hong Kong University of Science and Technology. His current research mainly focuses on CMOS RF IC and biomedical applications. His ongoing work includes RFID, PLL, low-power wireless transceivers, and smart clinic equipment with combination of leading edge CMOS RFIC and digital imaging processing techniques. He is co-authors of 11 books and book chapters, more than 118 paper in international Journals and over 350 papers in international Conferences. He is holding 75 Chinese patents and 4 US patent.
Prof. Wang has served as Deputy Chairman of Beijing Semiconductor Industries Association and ASIC Society of Chinese Institute of Communication, as well as Deputy Secretary General of Integrated Circuit Society in China Semiconductor Industries Association. He had been one of the chief scientists of the China Ministry of Science and Technology serves on the expert committee of the National High Technology Research and Development Program of China (863 Program) in the area of information science and technologies from 2007 to 2011. He had been an official member of China Committee for the Union Radio-ScientifqueInternationale (URSI) during 2000 to 2010. He was the chairman of IEEE Solid-State Circuit Society Beijing Chapter during 1999-2009. He served as a technologies program committee member of the IEEE International Solid-State Circuit Conference (ISSCC) from 2005 to 2011. He has been a steering committee member of the IEEE Asian Solid-State Circuit Conference (A-SSCC) since 2005 and has served as the technical program chair for the 2013 A-SSCC. He served as a Guest Editor for IEEE JOURNAL OF SOLID-STATE CIRCUITS Special Issue in December 2006, December 2009 and November 2014. He was an associate editor of IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS – PART II: EXPRESS BRIEFS and he is currently an Associate Editor for IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS.

Abstract
IoT (Internet of Thins) has variety of requirement for wearable devices. Implantable medical device (IMD) is an important aspect for wearable and medical application. An IMD is designed to be totally implanted in the human body or to replace an epithelial surface or a surface of the eye, through surgery, and remain in place after the intervention. The implantable cardiac pacemakers, implantable defibrillators, cochlear implants, implantable nerve stimulators (Functional Electrical Stimulation- FES), limb function stimulation, bladder stimulators, sphincter stimulators, diaphragm stimulators, analgesia, implantable infusion pumps, implantable active monitoring devices are all well know IMDs. In recent years, the requirements for electronically driven implantable devices are expand significantly, but there still are difficulties for the design of a IMD from the technology point of view witch including, limited materials available for encapsulation in the human body, long-life implantable batteries, packaging and interconnect systems have not been developed for flexible 3-dimensional microstructures, data and power communications from in body to on, or close to, the body are limited, microstructures, microsensors and microactuators have not been developed for medical applications.
In this presentation, the current potential application of IMDs which need the data communication between IMD and the external devices are examined. For the data communication from IMD to the external devices, very high burst data rate is required while the control/command information exchange between IMD and external devices requires continuous connection with a much lower data rate. Since the power efficiency is a critical issue for implantable medical devices, people have tried many ways to design communication protocols and circuits to provide a good compromise between these two types of communication. However, the huge gap between two types of communication turns to be the major factor to limit the system efficiency by using a single-band/mode transceiver. A dual-band/mode transceiver architecture with high energy efficiency is proposed for the IMDs, and the integrated circuit implementation techniques are investigated. This is an ultra-low power transceiver works in the 400MHz frequency band and the 2.4GHz band simultaneously with a shared antenna. The 400MHz data link transceiver will be used for biomedical data transmission with a data rate of up to 10 Mbps, while the 2.4GHz Bluetooth Low Energy (BLE) protocol transceiver consuming no more than 4mW will be used for control/command information exchange between the implanted devices and the external mobile devices. An active compensation scheme are used and implemented to solve the interference between the two bands when working simultaneously.

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